In what setting might the use of higher pressure ratings for soldered joints be warranted?

In high temperature applications, the use of higher pressure ratings for soldered joints is warranted due to the increased thermal expansion and the potential for higher stresses on the joint. At elevated temperatures, materials can become more pliable, which may affect their strength and adherence. Therefore, using soldered joints that are rated for higher pressures can ensure that they remain intact and functional under these demanding conditions. This approach helps to maintain the integrity of the plumbing system, preventing leaks and failures that could arise from thermal fluctuations and internal pressures.

In contrast, low temperature circuits, normal service conditions, or non-pressurized settings don't typically require the enhanced strength and reliability that higher pressure ratings provide, as the risks of failure or leakage in those scenarios are significantly reduced.